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Wafer Dicing: The Different Types You Can Choose

When designing integrated circuits, there is a process of separating the wafer semiconductor from its die. Here, we normally use dicing methods that involve things like breaking its mechanical sawing and then scribing the same. All this happens because of a machine known as dicing saw. The good thing is that this process of separation remains automated. This brings accuracy and even precision. When planning to do Wafer Dicing, be careful to avoid messing up the separation process.

There are various dicing techniques used. All these techniques get applied for various reasons. So, when choosing a dicing technique, go with the one that will separate that die better than others. Here are a few of the dicing techniques you can use for separation.

Stealth dicing
In the dicing process, diced chips use low temperatures, but with high tensile stress. This is one of the most effective processes for any kind of wafer. It can be applied to produce the nanometer-size dies. With this procedure, you don’t have to apply tape or water expansion. However, this dicing technique requires a huge minimum quantity order.

The main benefit of this dicing technique is that it will process your silicon wafer, but not without altering the surfaces. You achieve this by creating perforation rows under the wafer surfaces.

Traditional blade dicing
If you want to do Wafer Dicing, you can choose this traditional blade dicing, known to bring several benefits. That blade is designed to become versatile. It tends to cut off different materials such as silicon and glass. The blade thickness applied here depends on the exposure amount and materials on that material. With three types of blades here, you choose the right one that will be vital to that application.

Laser ablation
Another technique used for Wafer Dicing is laser ablation. This process comes with many benefits. To those who have used this dicing technology, it comes as a noncontact process. However, it is gentler compared to mechanical dicing. This laser ablation dicing method will start at the wafer top and remove materials layer by layer. The only downside with this dicing method is the fact that when not managed well, it can cause damage to the devices and layers. The laser dicing here is known to use a photon stream of high concentrations. It focuses on the beams with laser heats, creating voids.

This method works well but is expensive. However, it is best applied to handle thin wafers, reduce material losses, and reduce tool wear.

Cutting with the diamond blades
During semi-conductor manufacturing, you can cut it using diamond blades. The blade is used to separate a dis. The size of that diamond cutting blade used here determines the exposure amount and blade size. Other factors such as blade dressing, spindle speed, and feed rates can affect the results.

Dicing comes as a cutting process. It is applied to cut brittle and hard materials. When done right, the resulting edge becomes perfect.

The Wafer Dicing process you use is faster than the sawing. They do not need residual stress and cooling. Because it is used to separate the die, it is ideal that you know the type of dicing that will solve your needs.

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